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WFA501

WFA501 is a high-performance Wi-Fi 6 and BLE (Bluetooth 5.2) module in LGA package. It can be used to establish WLAN and Bluetooth connections. Supporting 2×2 + 2×2 MIMO, it provides a maximum data rate up to 1774.5Mbps.
With a compact and unified form factor of 20.0mm x 20.0mm x 2.3mm, WFA501 is an ideal Wi-Fi/Bluetooth solution for size-sensitive applications, and helps customers reduce product size and optimize application design cost. The surface-mount technology enhances its durability and robustness, and the LGA package ensures that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package allows for large-scale automated manufacturing that has strict requirements on cost and efficiency.
Designed with a reliable PCIe 3.0 interface to provide WLAN capability, WFA501 achieves low-power and high-speed data transmission. This, coupled with its compact size and extended temperature range, enables the module to meet Wi-Fi/Bluetooth application design requirements in industrial, consumer and automotive fields.

Products Description

• Wi-Fi 6 and BLE (Bluetooth 5.2) module
• 20.0mm x 20.0mm x 2.3mm
• LGA form factor
• Max. data rate of 1774.5Mbps
• Operating temperature range of -30°C to +85°C

Main Advantages

  • Wi-Fi/Bluetooth module supporting 2.4GHz, 5GHz and BLE (Bluetooth 5.2)
  • Supports DBS
  • Supports PCIe 3.0 interface, which provides higher data transmission rate and lower power consumption
  • Fast time-to-market: simple design minimizes design-in time and development efforts
  • Operating temperature range of -30°C to +85°C

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